Taking Bluetooth earphone assembly as an example, JAKA has built a card saving robot gluing workstation with features such as simple programming, path self adjustment, stable processing speed, and support for periodic gluing and batch modification, achieving automatic gluing.Pain points for Bluetooth earphone gluing requirementsBluetooth earphones come in various shapes and have a compact structure, integrating multiple modules such as audio, driver, microphone, Bluetooth, motion sensor, battery, etc. When applying glue, there are the following pain points:1) The path is complex, with many irregular arcs. As with common boxed headphones, the bottom outer diameter is about 5-7mm and the inner diameter is less than 4mm. Meanwhile, the internal components of the earphones are precise and diverse, resulting in complex paths.2) The precise gluing process is difficult to implement. For example, when filling the gap at the bottom of the earphones, it is necessary to evenly
